Shenzhen HongYi Electronics Co., Ltd. is a technology-intensive high-tech enterprise integrated with R&D, production and sales. Hongyi is specializing in the research, development, and production of all kinds of burn-in sockets, test sockets for IC package testing, such as BGA/EMMC/EMCP/QFN/QFP/TSOP/SOP/DFN/DDR, etc. as well as IC test sockets for CMOS image sensors, and BGA IC test stands (BGA IC test fixtures and BGA test sockets) for mobile phones, computer bridges chips, MP3, MP4, printers, communication hyperterminals, video adapters, digital cameras, and STBs, which include QFP test socket, QFN test socket, FPC test stand, test fixture for memory bank, test fixture for mobile phones, BGA planting ball, BGA burn-in socket, SENSOR test fixture and OV test stand.
Upon 22 years’ development, Hongyi has now 2 factories as well as 3 branded and registered trademarks (KZT, ANDK, HMILU ) and 7 invention patents in China.
While we are launching our marketing work worldwide, we will be dedicated to reforming and upgrading our technology with more passion and more efforts, striving to be an enterprise that can be trusted by the clients.
We look forward to your continuing guidance and support this year.