eMMC169/153 data recovery from Android phone SD style
EMMC153 BGA169 socket adapter SD interface smart digital device flash memory data recovery burn-in test programming code
This seat flip spring structure, using disposable mold molding, the quality is good, life is more than 100 thousand times. The use of the structure of the floating plate, effectively protect the needle, special needle head shaped protrusions can pierce the solder balls on the oxide layer and will not damage the solder ball. For IC there is a ball without the ball can be tested.
1) Support EMMC153 EMMC169 BGA153 BGA169 package NAND IC chip
* Support hot plug can be directly inserted card reader connected to the computer test.
* At the same time: Toshiba, Samsung and Hynix compatible, Intel, Sandisk (Xin Di) and all the same package 4BIT, 8BITEMMCFlash memory (PIN)
*At the same time compatible with 153-FBGA 169-FBGA, IC (11.5x13,12x16,12x18,14x18mm) of different sizes, can replace the limit frame to achieve the universal use of cost reduction
Note: each test block is limited to a size limit frame, always choose and other spacing frame need enough to buy USD8 (1 pcs)
Three: the compatibility with the ball without the ball test, good versatility, reducing the use cost.Using manual clamshell structure,Easy and simple operation.
*The floating plate structure is adopted, the positioning is accurate, the IC is convenient to take and put, and the work efficiency is higher.Can be tested and low level format.
Product selling point:
Support hot plug and a separate power switch and support through the USB interface or are connected by a connection and plate on needles are arranged corresponding to the pin test;
It can test 169-FBGA 162-FBGA 186-FBGA, 153-FBGA programming, 221-FBGA
Common IC size: 10 * 11mm, 11.5 * 13mm, 12 * 16mm, 12 * 18mm, 14 * 18mm can be customized size
The life is much longer than that of similar products at home and abroad, the test life of up to more than 10W times
The shrapnel adopts import beryllium copper by high precision die stamping forming, head shape imitation probe design, the late addition of hard, thick gold plating layer processing, so as to ensure product reliability and durability
Using contact structure, needle gold-plated, ensure good contact, a test with PCBA with positioning holes with accurate positioning, convenient replacement
The clamshell type structure, and not to hurt the hand. Under the pressure of the structure, simple and convenient operation, commonly used in automatic machine.
It is also compatible with: Toshiba, Samsung, Hynix, Intel, SanDisk Xin Di etc. all the same package 4bit, 8bit eMMC flash memory.
(1) IC in the direction of the flat into the elements, pay attention to the chip and the first leg of the element.
(2) directly insert the computer, open the corresponding test software to test.
Three, repair and maintenance
In the process of using the product, such as the discovery of test performance is not stable, it is recommended to use the following methods to solve:
1) use the gun to seat inside the removal of impurities, making good contact;
2) remove the element, use a rubber glue to the board solder joint and SD interface part of the gold finger wipe clean;
3) is found to be burnt or shrapnel inside base fracture, please buy the corresponding seat replacement;
4) with a multimeter measuring core voltage is abnormal, such as exceptions to the corresponding bad materials replacement (generally self recovery fuse and regulator damage), or replacement of the PCBA board;
5) it is prohibited to use the day that water, wash water and other organic solvents, such as washing, cleaning, so as not to damage the internal structure of the elements;
6) when not in use, please use the anti - static bag to seal to save, avoid the dust fall, affect the test performance of the product.