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eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips - EMMC EMCP Android Data Recovery Socket

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eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips

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eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
  • eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
  • eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
  • eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
  • eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
  • eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips
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eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chips

eMMC/eMCP Reballing stencil 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig Solder Ball Mounting NAND chi...

  • Application:

    eMMC eMCP NAND chips reball
  • material:

    stencil
  • Product description:

    1.Feature : 1. Use glass fiber for material , avoiding wrist fatigue for long operation ; 2. Moldcore u...

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eMMC/eMCP Reballing Tool 4 in 1 BGA Rework Station eMMC153 eMMC169 eMCP162 eMCP186 Reball Jig

Do not heat the stencil,this one is not for heating reball,it is an easy way to reball without heat!!!!


Usage video,this is high-end product usage video,but the usage same

http://v.youku.com/v_show/id_XNjgzMTI5MTg4.html?from=s1.8-1-1.2&spm=a2h0k.8191407.0.0 Usage: 1) put the tin solder paste through the stencil 1 T=0.12

2) remove the stencil 1 T=0.12 3) pour balls through stencil 2 T=0.15 4) remove the stencil 2 T=0.15 5) Weld the chip into your device


1.Feature :

1. Use glass fiber for material , avoiding wrist fatigue for long operation ;

2. Moldcore uses high accuracy CNC machining , accurate IC location ;

3. 4 in 1 design in the Steel mesh , capable apply to eMMC153/169 , eMCP162/186 IC reballing at the same time .

4. Moldcore designs with dismountable , easy to change through two screws , change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing .

5. High quality and durable

6. Tested before shipping

7. Easy to use


We're the original manufaturer , we can provide the lowest and competitive price , the shortest processing time is guaranteed ! ! ! If you have any inquiry , please contact us freely .



which is mainly responsible for the overseas sales and international Marketing/market for KaiZhiTong’s products.

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