* Apply to eMMC/eMCP of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .
* Apply to BGA153/169 & BGA162/186 & BGA221 test
* eMMC/eMCP data can be read and written fastly
* Accurate positioning on flat bottom pad and solder of eMMC/eMCP
* Support flat bottom and solder ball testing .
* Technical support and datasheet are available if you need .
* we are the original manufacturer and welcome anyone to be our distribution agents
* Professional manufacturer in all kinds of IC chip testing sockets and adapters.
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* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .
Specification and Dimension :
* Type : Test & Programming Socket ( with pcb , pogo pin / probe )
* Package : eMMC153/169 , eMCP162/186 , eMCP221
* Pin Pitch : 0.5 mm
* Applicable IC body size : 11.5X13mm , 12x16 mm , 12x18mm , 14x18mm
* eMMC/eMCP thickness : 0.8mm - 1.5mm