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Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test - BGA socket

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Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
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Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test

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    Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS seri...

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Analysis BGA256 high stable socket for IC design R&D test in Lab,research 

center and UFS series test



Analysis BGA256 high stable socket are as below:


1. Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.

2. Good quality Pogo pins were chosen for stable contact.

3. Materials of Popo pins:

Barrel - phophated bronze

Planger - Beryllium copper

Spring - Piano wire


3. Easy use for different customized eMMC chip sizes by using suitable guide plate. 

4. Special PCB adapter for soldering.

5. Simple and quick fixing.

6. Layout of the test socket can be customized.

7. Rating current: 0.5A.


BGA256 (2)

20150416_110416BGA256 (1)20150416_11024520150416_11030820150416_110316

which is mainly responsible for the overseas sales and international Marketing/market for KaiZhiTong’s products.

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