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BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket - BGA socket

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BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm BGA24(6*8)-1.0 BGA24 VFBGA24 burn in socket

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BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
  • BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01  burn in socket
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BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm 007-BGA-1.0-24-6X8-B-01 burn in socket

BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*6mm BGA24(6*8)-1.0 BGA24 VFBGA24 burn in socke...

  • Package:

    BGA24, VFBGA24
  • Pin Pitch:

    1.0mm
  • Pin Count:

    24 pins
  • Applicable IC body size:

    6*8mm
  • Product description:

    Specifications: ​​​​Part number:BGA24(6*8)-1.0 socket IC Package:BGA24, VFBGA24 Pin Pit...

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BGA24-1.0 OPEN TOP Burn in socket pin pitch 1.0mm IC size 6*8mm Pin Grid 5*5mm 4*4mm BGA24(6*8)-1.0 BGA24 VFBGA24 burn in socket

Specifications:

Part number:BGA24(6*8)-1.0 socket
IC Package:BGA
24, VFBGA24
Pin Pitch:1.0mm
Pin Count:24 pins
IC Size:6*8mm
Pin Grid:5*5mm;4*6mm
Structure:OPEN-TOP

Material & Performance:

socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50mΩ max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000MΩ 700V DC
Max Current Capacity : 1A
Temperature Rating:-55℃~+175 ℃
Life Span 25,000 Times (Mechanical)


BGA24

3

B.BGA socket New creation

a.connect with PCB ways Innovation

Socket New creation

                          Welding structure :                                                                                                         No need of welding structure:
                          Way:Fix by welding                                                                                                         Way:Fix by 4 screws
                          Pin length:1.83mm                                                                                                      Pin length:0.25mm
           
      Two structure features:
             1.Welding structure :
                Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
                effort , and once the socket is welded , it can’t be recycle ;
                2.No need of welding structure :
                Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is
                stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
                can be removed from the PCBA board , recycle and reduce test cost ;
all ways

b.Connect with IC ways Innovation

1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.“U”contact support any type of solder ball shape
(Ballno balldamaged ball,the drop of contact
surface is more than 0.2mm)
IC connect ways

C.HD picture to show the detailed product

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