BGA25 OPEN TOP burn in socket pitch 0.5mm IC size 2.951x2.757mm 

BGA25(2.951x2.757)-0.5 BGA25 VFBGA25 burn in programmer socket

Specifications:

Material & Performance:

socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50mΩ max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000MΩ 700V DC
Max Current Capacity : 1A
Temperature Rating:-55℃~+175 ℃

Life Span 25,000 Times (Mechanical)

A:Tips:

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Thanks. 

B.BGA socket New creation

a.connect with PCB ways Innovation

             1.Welding structure :

                Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and

                effort , and once the socket is welded , it can’t be recycle ;

                2.No need of welding structure :

                Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is

                stable , meantime shorten the assembly time , time-saving and reduce effort , and socket

                can be removed from the PCBA board , recycle and reduce test cost ;

b.Connect with IC ways Innovation

C.HD picture to show the detailed product