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VFBGA63 BGA63 Burn in Socket Test Socket Pin Pitch 0.8mm IC
Body Size 10.5x13.5mm,9x11mm Programmer Adapter Burning
Socket
Feature :
* Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .
* Apply to BGA63 FBGA63 test
* Accurate positioning on BGA64 test pad
* Technical support and datasheet are available if you need .
* we are the original manufacturer and welcome anyone to be our distribution agents
* Professional manufacturer in all kinds of IC chip testing sockets and adapters.
Specification and Dimension :
* Type : Test & Burn in Socket ( without pcb )
* Package : BGA63 , VFBGA63
* Pin Pitch : 0.8 mm
* Pin Count : 63 pins
BGA63-0.8 Adapter 9x11mm
