* Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .

* Apply to BGA63 FBGA63 test

* Accurate positioning on BGA64 test pad

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

More Quantities with LOWER PRICE!

* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .

Specification and Dimension :

* Type : Test & Burn in Socket ( without pcb )

* Package : BGA63 , VFBGA63

* Pin Pitch : 0.8 mm

* Pin Count : 63 pins

* Applicable IC body size : 10.5x13.5 mm

* We also provide size 9x11mm for this adapter

BGA63-0.8 Adapter 9x11mm 

Package Including :

1 * BGA63-0.8 adapter

1 * border limiter 10.5x13.5mm