* Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .
* Apply to BGA63 FBGA63 test
* Accurate positioning on BGA64 test pad
* Technical support and datasheet are available if you need .
* we are the original manufacturer and welcome anyone to be our distribution agents
* Professional manufacturer in all kinds of IC chip testing sockets and adapters.
More Quantities with LOWER PRICE!
* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .
Specification and Dimension :
* Type : Test & Burn in Socket ( without pcb )
* Package : BGA63 , VFBGA63
* Pin Pitch : 0.8 mm
* Pin Count : 63 pins
* Applicable IC body size : 10.5x13.5 mm
* We also provide size 9x11mm for this adapter
BGA63-0.8 Adapter 9x11mm
Package Including :
1 * BGA63-0.8 adapter
1 * border limiter 10.5x13.5mm