Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
Characteristics of eMMC BGA 162/186
Analysis EMMC162 BGA186 high stable socket are as below:
1. Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.
2. Good quality Pogo pins were chosen for stable contact.
3. Materials of Popo pins:
Barrel - phophated bronze
Planger - Beryllium copper
Spring - Piano wire
3. Easy use for different eMMC chip sizes by using suitable guide plate. Normally there are 4 sizes 11.5x13mm, 12x16mm, 12x18mm, 14x18mm.
4. Special PCB adapter for soldering.
5. Simple and quick fixing.
6. Layout of the test socket is LxWxH 34.55mmx28.8mmx30.3mm.
7. Rating current: 0.5A.
KZT eMMC BGA 169 153 analysis test socket, fixture, fixing or soldering socket with soldering plate. Easy to use.
ANDK SOCKETS Partners: SAMSUNG, Hynix, Sandisk, Intel, ASUS, Foxconn, ZTE, Toshiba, Kingston, Lenovo, MSI, Qualcomm, HUAWEI, ACER, TCL, Flextronics, BYD, etc.