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Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test - EMCP162 186 Test Socket

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Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test

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Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
  • Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test
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Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test

Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test

  • Product description:

    Analysis EMMC162 BGA186 high stable socket are as below: 1. Apply to different sizes of eMMC chi...

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Analysis EMMC162 BGA186 high stable socket for IC design R&D test in Lab,research center and UFS series test

Characteristics of eMMC BGA 162/186


Analysis EMMC162 BGA186 high stable socket are as below:


1. Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.

2. Good quality Pogo pins were chosen for stable contact.

3. Materials of Popo pins:

Barrel - phophated bronze

Planger - Beryllium copper

Spring - Piano wire


4. Easy use for different eMMC chip sizes by using suitable guide plate. Normally there are 4 sizes 11.5x13mm, 12x16mm, 12x18mm, 14x18mm.

5. Special PCB adapter for soldering.

6. Simple and quick fixing.

7. Layout of the test socket is LxWxH 34.55mmx28.8mmx30.3mm.

8. Rating current: 0.5A.


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KZT eMMC BGA 169  153 analysis test socket, fixture, fixing or soldering socket with soldering plate. Easy to use.

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