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EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code - EMCP162 186 Test Socket

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EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code

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EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
  • EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
  • EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
  • EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
  • EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
  • EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code
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EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code

EMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code

  • Interface Type:

    SD
  • Applicable:

    EMCP/BGA162 186
  • Applicaiton:

    Programming/Test/data recovery/burn-in
  • :

  • Product description:

    eMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-...

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Product Details

eMCP162 186 socket adapter connector smart digital device GPS device flash memory data recovery burn-in test programming code


Features:

1, Socket compatible with the ball without the ball test, IC bounding box can be replaced, as compared to similar products with long life, wide versatility;

2, Also compatible with: Toshiba, Samsung, Hynix, Intel, Sandisk (SanDisk) and other packages of 4BIT, 8BIT eMMC flash memory

3, Also compatible with 162-FBGA 186-FBGA;

4, Beryllium copper shrapnel imported high-precision molds by stamping, head-shaped imitation probe design, late and hard, thick gold plating process to ensure product stability and durability;

5, The contact module of the overall structure, reduce duplication locate problems and ensure their points of contact with the IC PAD precise alignment, the first test pass rate;

6, Welded structure to ensure good contact, test stability;

7, Using the structure under the pressure, more user-friendly manual of tests, convenient and simple to operate;

8, Compression IC plus spring integrally molded using a mold adaptive structure, to ensure that different thicknesses IC does not require any adjustment to its good contacts, the

IC test universal wide (thickness 0.6-2.0MM range can be tested)

9, Structure using injection molding, precision positioning, pick and place convenient IC, work more efficiently;


Test:

1, Parallel to the direction of the press into the IC SOCKET.

2, Inserted into a socket on the SD card reader connected to the computer and then select the appropriate test program.


Repair and maintenance:

In the use of this product can not be found during tests or test performance is unstable, it is recommended to use the following solutions:

1, With an air gun or anti-static brush to remove impurities inside SOCKET seat to good contact;

2, With anhydrous alcohol to clean SOCKET, the impurities adhered to the top of shrapnel clean so good contact;

3, Ss found inside SOCKET shrapnel burned or broken, please purchase the appropriate SOCKET replaced;

4, Plug the USB interface can not be detected, check the power switch is turned on or the computer USB connection is normal;

5. Do not use water that day, washer water and other organic solvents soaking, washing, to avoid damage to the internal structure SOCKET;

6, When not in use for a long time, use anti-static bag sealed to prevent dust falling, the impact of product testing performance.

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