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eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android

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eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
  • eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
  • eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
  • eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
  • eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
  • eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android
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eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android

eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android

  • Apply IC:

    eMCP221
  • Application:

    programming adapte HDD flash memory...
  • Condition:

    New
  • Supply Voltage:

    4-Other
  • Product description:

    Product features: 1. The standard SD interface mode, by reading card device and a computer connection o...

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eMCP221 Tester Socket Reader programmer BGA221 Data Recovery repair electronic diy kit SD USB tester universal program Android



Product features:

1. The standard SD interface mode, by reading card device and a computer connection or the programmer SD interface connected to the test or burn, etc. the corresponding operation.

2 compatible with the ball without the ball test, IC limit frame using a mold, can be selected according to the IC different size limit frame for replacement, achieve different sizes IC can be universal;

3 support hot plug, supported by the SD interface or through the pin connection and PIN connection board corresponding test;

4. The PCB with four layer circuit structure, reduce the product in use by the interference signal caused by unstable test, gold finger plating thickness processing to ensure use durability and contact;

5: Toshiba, Samsung, compatible with Intel, Sandisk and other brands, Hynix IC;

6. Shrapnel adopts import beryllium copper by high precision die stamping forming, head shape imitation probe design and the post with hard, thick gold plating layer processing, so as to ensure product stability and durability;

7 connection module using the overall structure, reduce duplication of positioning, to ensure that the contact point and PAD IC precise alignment, a test pass rate;

8. The socket and PCBA with positioning holes of the positioning precision and convenient replacement; socket adopts clamshell type structure, which is more convenient for manual testing, the operation is simple and convenient;

9 adopt the integral molding of the mold and the spring adaptive structure, guarantee the IC of different thickness does not need any adjustment to ensure its good contact test, IC universal wide (thickness 0.6-2.0MM range can be tested);

10 the structure of the injection molding, positioning precision, take and put IC convenient, higher efficiency;


http://www.andksocket.com/upload/2017-07/07/eMCP221fangaidanpianzhuanSDceshizuo1-ddf75.jpg

EMCP221 IC BGA221 drawings

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