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Our Admin
2020-01-02
350
Smart phone connector overall test solution
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Our Admin
2019-12-25
956
uMCP combined with LPDDR and UFS not only has high performance and large capacity, but also takes up 40% less space than PoP + discrete eMMC or UFS solutions, reduces memory chip occupation and enables a more flexible system design, High-density, low
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Our Admin
2019-12-13
469
Breakthrough progress in research of new vertical nano-ring gate devices where microelectronics is located
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Our Admin
2019-12-09
374
What is board test of a IC
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Our Admin
2019-12-09
394
World Semiconductor Conference 2019 boosts AI industry
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Our Admin
2019-12-09
352
Brief analysis of typical ESD damage risk in IC packaging and testing factory
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Our Admin
2019-08-07
452
A number of chip companies announced mass production of 5G chips
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Our Admin
2019-06-26
405
New memory puts new demands on process and equipment
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Our Admin
2019-05-27
515
Micron DRAM and NAND Flash latest technology roadmap announced
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Our Admin
2019-05-17
400
Top ten analog IC factories from IC insight
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Hot products
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SOP8(16)-1.27 bur...
SOP8(16)-1.27 SO...
SSOP8(28)-0.65 S...
SSOP24(34)-0.65 ...
SOP14(16)-1.27 S...
SSOP28(34)-0.65 ...
eMMC153/169 socke...
eMMC100 eMMC15...
QFN12 MLF12 B...
eMMC data recover...
SOP8x2(20)-1.27 D...
SSOP14(28)-0.65 ...
SSOP30(34)-0.65 ...
SOP8 150mil Pit...
SOP8(20)-1.27 SO...
eMMC153/169 BGA...
SOP20-1.27 PIN ...
SOP16(20)-1.27 re...
SOP16(28)-1.27
SOP14(16)-1.27 so...
SOP16-1.27 recept...
BGA24-1.0 Clams...
SOP16-1.27 SOP...
High Quality eMC...
EMMC153 169 EM...
eMMC153/169 socke...
QFN12 MLF12 O...
SOP8(20)-1.27
SOP8x2(20)-1.27 S...
SOP18(28)-1.27 so...
QFP32 TQFP32 ...
QFP176 TQFP17...
BGA80 OPEN T...
eMCP162/186 reade...
EMMC153 BGA16...
EMMC153 BGA16...
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