eMMC153/169 BGA153 BGA169 Burn in Socket Pin Pitch 0.5mm IC Body Size 12x16mm Clamshell Test Socket Adapter Data Recovery
* Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .
* Apply to BGA153 & BGA169 test
* eMMC data can be read and written fastly
* Accurate positioning on flat bottom pad and solder of eMMC
* Support flat bottom and solder ball testing .
* Technical support and datasheet are available if you need .
* we are the original manufacturer and welcome anyone to be our distribution agents
* Professional manufacturer in all kinds of IC chip testing sockets and adapters.
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* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .
Specification and Dimension :
* Type : Test & Burn in Socket ( without pcb )
* Package : eMMC153/169 , BGA153/169
* Pin Pitch : 0.5 mm
* Pin Count : 30 pins
* Applicable IC body size : 12x16 mm,11.5x13mm , 12x18mm , 14x18mm
* eMMC thickness : 0.8mm - 1.5mm
Applicable borders limiter / frame guider as below :
Single size 11.5x13mm
Single size 12x16mm
Single size 12x18mm
Single size 14x18mm