QFP48 Burn in Socket for Automotive MCUs

Package Compatibility & Electrical Performance
- Supported Packages: Designed for QFP48 (0.5mm pitch), compatible with PQFP48, TQFP48, LQFP48 variants; accommodates chip body size of 7×7mm.
- Electrical Characteristics:
  - Contact resistance ≤30mΩ (initial), insulation resistance ≥1000MΩ (DC 500V), dielectric withstand voltage AC 700V/1 min.
  - Supports up to 1A current for high-load automotive MCU testing.
Mechanical Structure & Durability
- Press-down Spring Design: Beryllium copper springs (nickel-gold plated) with 30g/pin contact force ensure signal stability.
- Lifespan & Temperature Resistance:
  - Mechanical endurance: 15,000 insertions (degradation <1%).
  - Operating temperature: -55℃ to 175℃. Socket body material: PEI (Polyetherimide) for high dimensional stability and anti-creep performance.

High-Temperature/Humidity Materials:
- Base material: UL94 V-0 flame retardant. Sustains >200 hours at 130℃–150℃; >5,000-hour cumulative lifespan at 135℃.
- Contacts: Gold-plated beryllium copper terminals resist oxidation in HAST environments.
Sealing Structure:
Stainless steel frame + silicone seal ring (20% compression), leakage rate <0.1 atm/h under pressure.

Heat Dissipation: Integrated heat pipes/vapor chambers (<0.1℃·cm²/W thermal resistance) with external cooling maintain ±1℃ temperature uniformity at 130℃.
Signal Integrity:
- Multi-channel isolation design (>4kVrms withstand voltage), optocouplers isolate high/low voltage signals to reduce leakage (<1μA).
- Creepage distance complies with IEC 60664 (Pollution Degree 3).

Automotive Compliance
- Supports AEC-Q100 certification tests:
  - Multi-stress coupling: Applies 1.2× rated voltage (e.g., 5V→6V) + 150℃, monitoring register flip rate <10⁻⁹/hour.
  - Thermal cycling: -40℃–150℃. Carbon fiber supports (CTE 4.5ppm/℃) mitigate contact failure from thermal expansion.
HAST Test Procedure
- Conditions: Per JEDEC JESD22-A110 and AEC-Q100 standards: 130℃/85% RH/2.3 atm for 96 hours.
- Anomaly Detection: Real-time data acquisition (10kSPS, ±0.05% precision) triggers alarms (<1s response) for critical drift (e.g., leakage current rise >50%).

Case Study:
Used for MCU HAST testing
Technical Innovations:
- AI Integration: Edge computing modules (e.g., NVIDIA Jetson) predict chip lifespan (>90% accuracy).
- Sustainability: >90% recyclable modular design, RoHS 3.0 compliant.

Pre-HAST Preparation:
- Clean contact springs before testing.
- Replace seals every 500 cycles.
Calibration: Recalibrate temperature/humidity sensors (±2% RH precision) every 48 hours.