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The pins involved in programming Nand Flash chips vary depending on the interface type (parallel or SPI). Below are the key pins and their functions:
1. Parallel Nand Flash Programming Pins
Parallel interfaces are common in high-capacity Nand Flash, using multiplexed data lines for commands, addresses, and data. Key pins include:
- I/O[7:0]: 8-bit bidirectional data bus for commands, addresses, and data.
- Control Signals:
- CLE (Command Latch Enable): High level indicates command transmission (e.g., program command
80h). - ALE (Address Latch Enable): High level indicates address transmission (page/column addresses).
- CE# (Chip Enable): Active-low signal to select the chip.
- WE# (Write Enable): Rising edge latches commands/addresses/data.
- RE# (Read Enable): Falling edge triggers data output (read operations).
- CLE (Command Latch Enable): High level indicates command transmission (e.g., program command
- Status & Protection:
- R/B# (Ready/Busy): Open-drain output; low indicates busy state (e.g., during programming/erasure).
- WP# (Write Protect): Active-low signal to lock programming/erasure.
- Power & Ground: VCC (2.7–3.6V), VSS (ground).
2. SPI Nand Flash Programming Pins
SPI interfaces use fewer pins, suitable for space-constrained designs:
- /CS (Chip Select): Active-low chip selection.
- CLK (Serial Clock): Synchronizes data transfer.
- Data Lines:
- Standard SPI:
DI(host→device),DO(device→host). - Dual/Quad SPI:
IO0–IO3for higher-speed transfers.
- Standard SPI:
- Auxiliary Pins:
- /WP (IO2): Write protection (may double as
IO2in Quad mode). - /HOLD (IO3): Pauses transmission (may double as
IO3).
- /WP (IO2): Write protection (may double as
🔌 BGA132/152 Test Socket Product Introduction
BGA132/152 test sockets are critical tools for programming, testing, and aging SSD flash memory chips (e.g., 3D NAND). Below is a comprehensive overview:
📐 1. Key Specifications
- Compatible Packages: BGA132 (12×18 mm) and BGA152 (14×18 mm) .
- Pin Pitch: 1.0 mm .
- Contact Type: High-precision probe needles (not spring pins) .
- Current Rating: Up to 3A, supporting high-frequency testing .
- Lifespan: 100,000–150,000 cycles .
- Temperature Range: -40°C to 155°C .
🛠️ 2. Design Features
- Flip-Top Mechanism: Allows easy chip insertion/removal and secure clamping .
- Interchangeable Limit Frames: Adapt to BGA132 or BGA152 chips by swapping frames .
- Ball/No-Ball Compatibility: Tests both pre-soldered and bare chips reliably .
- Probe Material: Beryllium copper probes puncture oxide layers on solder balls without damage, ensuring stable contact .
- Enhanced Usability:
- 105° lid angle for easier access .
- Extended hand buckle and optimized probe exposure reduce chip wobble .
⚡ 3. Performance Advantages
- Higher Yield: Probes improve test stability by 3–8% compared to spring contacts, especially for 3D NAND .
- Speed: Supports frequencies up to 20 GHz (vs. 0.4 GHz for spring pins) .
- Durability: Resists dust ingress and maintains low impedance (60 mΩ vs. 3,000 mΩ in spring pins) .
🔄 4. New vs. Old Models
| Feature | New Model | Old Model |
|---|---|---|
| Lid Angle | 105° (easier access) | 95° (less ergonomic) |
| Hand Buckle | Extended, better grip | Short, harder to operate |
| Probe Exposure | Reduced (less chip wobble) | Higher (causes instability) |
| Chip Placement | Elevated for easier handling | Lower, less convenient |
| Pressure Block | Wider (even contact) | Narrow (uneven force) |
| *Based on * |
💻 5. Applications
- SSD/Flash Testing: Used with SM2246EN/SM2258XT controllers for 8CE NAND testing .
- Multi-Chip Support: Adapters like DIP48 allow compatibility with U disk testers or SSD racks .
- Aging & Programming: Deployed in burn-in, clearing, and programming workflows .
