I. Optical Heart Rate Monitoring Chips: Core Technology for Wearable Health Management
Optical heart rate monitoring relies on Photoplethysmography (PPG), emitting specific wavelengths (primarily green light) into the skin to detect periodic changes in light absorption by blood flow. This enables calculations of heart rate and blood oxygen saturation (SpO₂). Core chip requirements include:
- High Precision & Low Power Consumption:
- Leading chips (e.g., TI AFE4400, Maxim MAX30102, Analog Devices ADPD4100) integrate LED drivers, photodetectors, and digital signal processing units for real-time data handling .
- Next-gen LEDs like ams OSRAM’s CT ELLN51.14 (1.2mm×1.0mm) boost light power by 20%, enhancing signal quality for earables/ring-type devices .
- Multi-Wavelength Synergy:
- SpO₂ detection requires 660nm red light (absorbed by oxygenated hemoglobin) and 940nm infrared light (absorbed by deoxygenated hemoglobin), with absorption ratios determining SpO₂ levels .
- Motion Artifact Resistance:
- Integrated accelerometer data fusion (e.g., STM32 microcontrollers) and noise-canceling algorithms improve accuracy during physical activity .
II. Aging Test Sockets for Biometric Chips: Why Specialized Designs Matter
Burn-in testing accelerates failure detection by simulating extreme conditions (high temperature, humidity, sustained loads). Wearable biometric chips demand test sockets with:
- Wide Temperature Adaptability:
- Medical-grade chips require testing from -55°C to 155°C (AEC-Q100 automotive standard) to ensure stability in diverse environments .
- High-Frequency Signal Fidelity:
- Heart rate signals up to 300MHz necessitate gold-plated beryllium copper probes (parasitic inductance <0.1nH) or elastic connectors to minimize impedance fluctuations (contact resistance <50mΩ) .
- Long-Term Durability:
- Test durations up to 1,000 hours require probes/sockets enduring >500,000 insertions and mechanical lifespans exceeding 15,000 cycles .
Table: Mainstream Aging Test Socket Architectures
| Structure Type | Best For | Advantages | Representative Models |
|---|---|---|---|
| Hinge-Knob | High-pin QFP packages | Even pressure, easy operation | ANDK Electronics QFP240-pin |
| Press-Down Elastic | Compact QFN devices | Vibration-resistant, space-efficient | ANDK QFP100 Press-Down |
| Dual-Latch | Automated production lines | Manual/auto compatibility, long lifespan | DFN8 Dual-Latch Socket |
III. Innovations in Aging Test Sockets: Thermal Management, Structure & Intelligence
- Thermal Management Breakthroughs:
- Traditional copper sockets struggle with heat dissipation. New designs embed diamond layers (thermal conductivity: 2,000 W/m·K vs. copper’s 400 W/m·K) into copper bases, using through-holes to accelerate heat transfer and avoid thermal resistance from soldering .
- Space Efficiency Optimization:
- Elastic components replace lever-reset structures (e.g., HongYi patents), reducing volume by 30% and enabling higher test-board integration .
- Smart Testing Integration:
- PCIe 5.0 and 10Gbps programming speeds enable multi-channel parameter collection via Automated Test Equipment (ATE), achieving 99.99% yield rates .
IV. Special Testing Requirements for Elderly-Focused Wearables
Devices for seniors demand enhanced reliability, necessitating:
- Anti-Interference Reinforcement:
- Complex environments (EMI, humidity fluctuations) require Highly Accelerated Stress Screening (HASS) and 85% RH humidity cycling .
- Longevity Validation:
- Fall-detection features require >5-year lifespans, validated by 3,000+ hours of aging tests covering battery degradation models .
- Cost-Effective Solutions:
- Elastic-contact sockets (30% cheaper than probe types) suit consumer chips like SOP8 power management ICs .
V. Future Trends: High-Density & Multi-Parameter Integration
- Chiplet & 3D Packaging Testing:
- High-density sockets must support ultra-fine-pitch (0.35mm) QFN packages, driving miniaturized probes and carbon-fiber substrates .
- Multi-Parameter Fusion Testing:
- Next-gen biometric chips integrate heart rate, blood pressure, and glucose monitoring, requiring synchronized multi-sensor signal testing .
- Localization Acceleration:
- Companies like ANDK Electronics use carbon fiber-invar composites and wide-temperature designs to replace imported automotive-grade sockets .
Conclusion
Aging test sockets for wearable biometric chips serve as the “gatekeepers” of vital sign data reliability. Innovations—from probe materials and thermal management to elderly-use adaptations and high-density support—are driving smarter, more resilient testing systems. As biosensing chips expand into medical applications, these test solutions will become critical battlegrounds for global semiconductor competitiveness .
Note: Technical cases reference patents and industry solutions from semiconductor test equipment manufacturers.